EloPin is a press-fit technology that enables a secure, solder-free connection of components to printed circuit boards. It is pressed directly into the PCB and, thanks to its specific geometry, provides a mechanically stable and highly reliable electrical contact – without thermal stress. NESPER offers comprehensive expertise in the manufacture of EloPin.
With solder-free connection technology, you benefit from higher process reliability, reduced manufacturing costs and a sustainable solution that can be integrated seamlessly into automated production lines.
EloPin – Detailed view
EloPin – on the line
EloPin – Einzelteil
As a licensed manufacturer, we can also supply our customers with the complete EloPin® size portfolio (04-06, 06-10, 08-145, 08-16, 12-20).
In addition to stamping from coil material, we are also experts in joining technology.
Within the production process we feed ceramic pins, rivets or thermally fractured or turned contact pins and join them with the stamped component.
We also master the joining of multiple strips using TOX® connections.
Wide range of stamping materials
We supply EloPin solutions with a defined press-in zone – series-ready, 100% inspected and fully documented.
