Leadframes provide the stable and conductive foundation of many electronic components. They ensure reliable power supply and control – whether in the automotive industry, in power electronics or in innovative applications related to renewable energy.
At NESPER, we combine peak precision with cutting-edge manufacturing technology. Our fully automated, integrated processes ensure consistently high quality at every step – from stamping and cleaning to downstream operations such as bending or plastic overmolding.
Thanks to our long-standing expertise, complex processes such as riveting, embossing/coining, welding and joining, as well as the processing of selectively electroplated strip materials, are part of our standard capabilities. Automated 100% inspection ensures that cleanliness and surface quality meet the highest requirements – the perfect basis for subsequent processes such as wire bonding, molding or bonding/adhesive joining.
Leadframes and stamped grids for power electronics applications.
Punched grids, separated and bent
